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It is a negative-type resist material that combines extensibility.
The "STC Series" is an acrylic-based negative resist material that possesses the following characteristics: - Stretchability - High sensitivity - High transmittance - High adhesion - Low-temperature curing Please feel free to contact us if you have any inquiries.
We provide unique resist materials that leverage our proprietary acrylic resin design technology to contribute to the high functionality of advanced devices.
It can be customized to fit your needs and processes. Please feel free to contact us. ■ Photo spacer material - Good patterning properties; line width: 4μm to over 20μm - Thin film compatibility; height: 0.8μm to over 10μm - Low-temperature curing compatibility; firing temperature: ≧120℃ ■ Thick film resist material - Compatible with various shapes; columnar (dot), linear (L/S), lattice, dome-shaped, positive taper, negative taper - Thick film compatibility; height: 10μm to 100μm ■ Micro lens material - High transparency - Low-temperature curing compatibility; firing temperature: ≧100℃ ■ Insulating film material - High chemical resistance, high adhesion, high transparency - Low-temperature curing compatibility; firing temperature: ≧100℃ - Constant temperature and humidity resistance; 85℃/85%RH, 100 V, Ag or Cu wiring board, no change in resistance value for over 500 hours - Flexible compatibility available
It is an acrylic-based negative photoresist material that can be produced in lens shapes.
The "PML series" is a negative resist material that enables pattern formation with lens shapes possessing the following characteristics: ■ High sensitivity: ≧ 50 mJ/cm² ■ High transmittance: ≧ 97% (Average @380~780 nm) *Please feel free to contact us if you have any requests.
It is a negative-type thick film resist material that can create patterns of various shapes.
The following is a negative-type thick film resist material with good exposure sensitivity and transmittance. ■ High sensitivity: ≧ 100 mJ/cm² ■ High transmittance: ≧ 90% (Average @ 380~780 nm) ■ Applicable to various exposure conditions and pattern shapes Thickness: 10-50 μm, line width: ≧ 10 μm, exposure wavelengths: g, h, i –line Please feel free to contact us if you have any inquiries.
This is a positive resist material that can be used in the dry etching process.
The "UPP Series" is a positive resist material for wiring formation applications, possessing the following characteristics and suitable for use in dry etching processes. ■ High sensitivity: ≧ 40 mJ/cm² ■ Good patterning performance: ≧ 4 μm ■ Good dry etching resistance *Please feel free to contact us if you have any inquiries.*
It is an acrylic negative photoresist material suitable for lift-off processes, capable of producing inverted taper shapes and hole patterns.
The "SA Series" is a negative-type resist material that can form an inverse taper shape and hole patterns with the following characteristics: ■ Capable of forming thick films: ≦ 20 μm ■ High sensitivity: ≧ 60 mJ/cm² ■ High heat resistance: ≦ 130℃ ■ Can be removed with organic solvents at room temperature *Please feel free to contact us if you have any requests.
